100G No Clean Lead Solder Flux Paste
Volume : 100 g / bottle It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing. Feature : Excellent capacity of solder-stickiness Excellent Anti-wet Capacity Widely used on BGA, PGA, CSP packages and flip chip operation Suitable for multiple PCB reflow No-clean and Lead free for environmental protection Package included : 1 x Solder Flux Solder Paste Details pictures : Lees meer over de 100G No Clean Lead Solder Flux Paste van huismerk in de productgroep tools
7,24
Merk | huismerk |
voorraad | yes |
Levering | Bezorgen of afhalen |
Staat | Nieuw en Tweedehands |
Aanbieding | Bekijk de prijs |
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