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Japan Steel Phone Logic Board Bga Repair Stencil For Iphone 6S 6Sp Motherboard Ic Chip Ball Soldering Net

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Japan Steel Phone Logic Board Bga Repair Stencil For Iphone 6S 6Sp Motherboard Ic Chip Ball Soldering Net huismerk kopen in de aanbieding
Japan Steel Phone Logic Board Bga Repair Stencil For Iphone 6S 6Sp Motherboard Ic Chip Ball Soldering Net huismerk met korting kopen in de aanbieding
Features : Efficient : quick alignment for operating of reballing Easy : positioning pins for precise alignment Durable : Long Time Operating and Usage Lifetime Application Model : iphone 6s Plus, 6s Function : Repairing or fixing problem of iphone 6s Plus 6s processor Package includes : 1 x BGA Reballing Stencils for iPhone 6s/6SP Details pictures : Lees meer over de Japan Steel Phone Logic Board Bga Repair Stencil For Iphone 6S 6Sp Motherboard Ic Chip Ball Soldering Net van huismerk in de productgroep tools

5,01

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