Japan Steel Phone Logic Board Bga Repair Stencil For Iphone 6S 6Sp Motherboard Ic Chip Ball Soldering Net
Features : Efficient : quick alignment for operating of reballing Easy : positioning pins for precise alignment Durable : Long Time Operating and Usage Lifetime Application Model : iphone 6s Plus, 6s Function : Repairing or fixing problem of iphone 6s Plus 6s processor Package includes : 1 x BGA Reballing Stencils for iPhone 6s/6SP Details pictures : Lees meer over de Japan Steel Phone Logic Board Bga Repair Stencil For Iphone 6S 6Sp Motherboard Ic Chip Ball Soldering Net van huismerk in de productgroep tools
5,01
Merk | huismerk |
voorraad | yes |
Levering | Bezorgen of afhalen |
Staat | Nieuw en Tweedehands |
Aanbieding | Bekijk de prijs |
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