S450 3D Bga Reballing Stencil Communication Logic Module Repair Tool For Iphone 5 5S 6 6S 7G 7Plus 8 8P
Features : 3D laser square hole BGA reballing stencil template. High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient. New patented iphone X Middle Layer Motherboard for iPhone X Middle layer motherboard. Assisting professionals to do iPhone X BGA reballing in the most convenient and safest way. Specification : Type : A : for iPHone 5/5s B : for iPHone 6/6p C : for iPHone 6s/6sp D : for iPHone 7/7p E : for iPHone 8/8p Package included : 1 x BGA Reballing Tool Details pictures : Lees meer over de S450 3D Bga Reballing Stencil Communication Logic Module Repair Tool For Iphone 5 5S 6 6S 7G 7Plus 8 8P van huismerk in de productgroep tools
6,77
Merk | huismerk |
voorraad | yes |
Levering | Bezorgen of afhalen |
Staat | Nieuw en Tweedehands |
Aanbieding | Bekijk de prijs |
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