Cpu Module Motherboard Reballing Kit Stencils Tin Planting Network Steel Net Repair Tool For Iphone 5S66S77P88P A7 A8 A9 A10 A11
Features : 3D laser square hole BGA reballing stencil template. High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient. New patented iphone X Middle Layer Motherboard for iPhone X Middle layer motherboard. Assisting professionals to do iPhone X BGA reballing in the most convenient and safest way. Specification : Type : A7 CPU / A8 CPU / A9 CPU / A10 CPU / A11 CPU Package included : 1 x BGA Reballing Tool Details pictures : Lees meer over de Cpu Module Motherboard Reballing Kit Stencils Tin Planting Network Steel Net Repair Tool For Iphone 5S66S77P88P A7 A8 A9 A10 A11 van huismerk in de productgroep tools
6,77
| Merk | huismerk |
| voorraad | yes |
| Levering | Bezorgen of afhalen |
| Staat | Nieuw en Tweedehands |
| Aanbieding | Bekijk de prijs |
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