Kaisi 3D Ic Chip Bga Reballing Stencil Kits A8 A9 A10 A11 A12 Tin Planting Net Hand Tools For Iphone 66 Plus 6S6S 77 8X Xsxr
Features : This 3D BGA reball stencils can location the IC chip when you repair, its so convenient, stable and accurately. No need IC holder station. Type : A : A8 : Suitable for iPhone 6/6 plus B : A9 : Suitable for iPhone 6S/6S Plus C : A10 : Suitable for iPhone 7/7 plus D : A11 : Suitable for iPhone 8/X E : A12 : Suitable for iPhone XS/XR Notice : 1.The package dont include any IC. 2. Sometimes the factory update the BGA Reballing Stencil, the size maybe different, but the function is same. Package Included : 1x A8/A9/A10/A11 Set 3D BGA Reball Stencils Detail Pictures : Lees meer over de Kaisi 3D Ic Chip Bga Reballing Stencil Kits A8 A9 A10 A11 A12 Tin Planting Net Hand Tools For Iphone 66 Plus 6S6S 77 8X Xsxr van huismerk in de productgroep tools
12,22
| Merk | huismerk |
| voorraad | yes |
| Levering | Bezorgen of afhalen |
| Staat | Nieuw en Tweedehands |
| Aanbieding | Bekijk de prijs |
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